内容简介： Category Course Title Content 类别培训内容 课程内容 QFA1:电子封装简介 Brief introduction of electronic package Failure Analysis on ElectronicPackaging 失效定义及分类 Definition and classification of failures 电子产品为何失效 Why do electronic products fail 失效分析的目标 The objectives of failure analysis 电子封装失效分析 失效分析的重要性 Understand the importance of failure analysis 失效分析的思想方法 Philosophical approach of failure analysis 0.5 day失效分析技术线路 0.5 天 Technique approach of failure analysis
Failure analysis flow charts 元器件典型失效模式和机理 Typical failure modes and failure mechanisms of electronics components QFA2:产品可靠性浴盆曲线 Reliability Tests and Qualification of Plastic Packaged Ics Product reliability and bathtub curve 筛选试验，可靠性试验，可靠性认证 Screening tests, reliability tests, qualification tests 常见可靠性试验、目的、诱导的典型失效模式及机理等 可靠性试验及封装认证 Common reliability tests, objectives, typical failure modes and mechanisms 典型集成电路塑料封装器件的封装认证标准简介 0.5 dayTypical standards on package qualification of plastic packaged ICs 0.5 天器件结构分析 Package construction analysis QFA3:塑料封装器件中的水汽扩散、回流焊接过程中湿气蒸发引起 的分层、爆裂等失效现象 Moisture Sensitivity and Relevant Issues Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc. 器件湿气敏感性分级：JESD020C:非气密性表面封装固态电路的水汽/回流敏感性等级 Moisture sensitivity level: JESD020C: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 塑料封装器件的潮气敏感性及相关问题 如何判断与湿气敏感性相关的失效的根本原因：器件质量还是电子组装？ 0.5 day How to judge the root cause when popcorn crack happens: device quality or SMT problem? 0.5 天器件怀疑吸湿如何处理：实用指南 What to do, if your devices are susceptible of excessive moisture absorption: a practical guide
QFA4:焊接界面形成 Solidification and interface intermetallics formation Soldering & Solder Joint Failure Analysis电子产品服役过程中焊料组织及界面金属间化合物的演化及其与焊点失效的关系 Evolution of solder micro-structure and interface intermetallics and effects on solder joint lifetime 焊接及焊点失效分析 影响焊点寿命的典型设计、工艺、材料等因素 0.5 day Typical design, material, process parameters affecting soldering joint lifetime 0.5 天焊点失效分析流程 Typical flow chart for solder joint failure analysis 焊点失效典型模式及分析方法 Typical failure modes and analysis method
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Category Course Title Content
类别培训内容 课程内容
QFA1:电子封装简介
Brief introduction of electronic package
Failure Analysis on ElectronicPackaging
失效定义及分类
Definition and classification of failures
电子产品为何失效
Why do electronic products fail
失效分析的目标
The objectives of failure analysis
电子封装失效分析
失效分析的重要性
Understand the importance of failure analysis
失效分析的思想方法
Philosophical approach of failure analysis
0.5 day失效分析技术线路
0.5 天 Technique approach of failure analysis
Failure analysis flow charts
元器件典型失效模式和机理
Typical failure modes and failure mechanisms of electronics components
QFA2:产品可靠性浴盆曲线
Reliability Tests and Qualification of Plastic Packaged Ics Product reliability and bathtub curve
筛选试验，可靠性试验，可靠性认证
Screening tests, reliability tests, qualification tests
常见可靠性试验、目的、诱导的典型失效模式及机理等
可靠性试验及封装认证 Common reliability tests, objectives, typical failure modes and mechanisms
典型集成电路塑料封装器件的封装认证标准简介
0.5 dayTypical standards on package qualification of plastic packaged ICs
0.5 天器件结构分析
Package construction analysis
QFA3:塑料封装器件中的水汽扩散、回流焊接过程中湿气蒸发引起 的分层、爆裂等失效现象
Moisture Sensitivity and Relevant Issues Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc.
器件湿气敏感性分级：JESD020C:非气密性表面封装固态电路的水汽/回流敏感性等级
Moisture sensitivity level: JESD020C: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
塑料封装器件的潮气敏感性及相关问题
如何判断与湿气敏感性相关的失效的根本原因：器件质量还是电子组装？
0.5 day How to judge the root cause when popcorn crack happens: device quality or SMT problem?
0.5 天器件怀疑吸湿如何处理：实用指南
What to do, if your devices are susceptible of excessive moisture absorption: a practical guide
QFA4:焊接界面形成
Solidification and interface intermetallics formation
Soldering & Solder Joint Failure Analysis电子产品服役过程中焊料组织及界面金属间化合物的演化及其与焊点失效的关系
Evolution of solder micro-structure and interface intermetallics and effects on solder joint lifetime
焊接及焊点失效分析
影响焊点寿命的典型设计、工艺、材料等因素
0.5 day Typical design, material, process parameters affecting soldering joint lifetime
0.5 天焊点失效分析流程
Typical flow chart for solder joint failure analysis
焊点失效典型模式及分析方法
Typical failure modes and analysis method
本课程名称： FA电子封装失效分析
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