6. 3D封装IC及晶圆级封装技术专题(Enabling Technologies for 3D IC Integration and WLP)
Overview of 3D IC integration and packaging
TSV forming (DRIE and laser)
TSV dielectric, barrier, and seed-metal layers
TSV filling and CMP
Effects of TSV interposer on thermal performances on SiP
Effects of TSV interposer on mechanical performances on SiP
Stress sensor for thin-chip strength measurement
Wafer thinning and thin-wafer handling
Low-cost lead-free microbumps (≤25µm pitch): fabrication and characterization
Low-cost lead-free microbumps (≤25µm pitch): assembly and reliability
Low temperature (≤180oC) C2W bonding
Low temperature (≤180oC) W2W bonding
CMOS image sensor with TSV
3D MEMS packaging with TSV
3D LED and IC integration
Thermal management (design charts and guidelines) for 3D stacked chips
Integrated liquid cooling solutions for 3D stacked modules
Hot spots in thin chips for 3D stacking
Embedded 3D IC WLP
Optical PCB
Supply chain for 3D IC integration and packaging
Critical issues in adopting TSV with RDL and 3D IC integration
Summary
培训师介绍
John H Lau(中文授课) 美国伊利诺里大学理论和应用物理系博士,结构工程、工程物理和管理科学三个硕士学位,ASME 会士、IEEE 会士。2009 年1 月至今香港科技大学访问教授。此前,担任新加坡微电子所微机系统、模块和元件实验室主任两年,在美国HP 和Agilent 公司担任资深科学家近20 年。具有30 年研发和制造经验,发表300 多篇技术论文,100多 篇专著章节,进行250 次以上演讲。编写或参与编写过16本教科书,内容涉及先进封装,焊点可靠性,无铅焊接和制造等。 John Lau has been a visiting professor at HKUST (Hong Kong University Science & Technology) since January 2009. Prior to that, he was the Director of Microsystems, Modules & Components (MMC) Laboratory with Institute of Microelectronics (IME, Singapore) for 2 years and a Senior Scientist/MTS at HP/Agilent in US for more than 20 years. With more than 30 years of R&D and manufacturing experience, he has authored or co-authored more than 300 peer-reviewed technical publications and more than 100 book chapters, and given more than 250 presentations. He has authored and co-authored 16 textbooks on advanced packaging, solder joint reliability, and lead-free soldering and manufacturing. John earned his Ph.D. degree in theoretical and applied mechanics (University of Illinois) and three M.S. degrees in structural engineering, engineering physics and management science. He is an elected ASME Fellow and has been an IEEE Fellow since 1994.
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课程大纲
1. 印制板基材、制造及选择
1.1 印制板表面镀层选择
1.1.1 案例
印制板表面镀层案例:镀金、镀水金可焊性比较;
化学镍金镀层案例:黑盘;
浸锡与热风整平工艺案例:浸锡表面焊接失效;ENIG表面镀层更改。
1.1.2 涉及相关知识节点及解决方法
电镀金、电镀水金、化学镍金介绍、比较与选择以及工艺注意事项;
黑盘相关知识:磷对于镍层杂质的影响以及焊点界面影响;
ENIG、镀金、镀水金、OSP以及HASL表面选择。
1.2 印制板基材及参数选择
1.2.1案例
混装板基材选择案例:无铅元件、有铅焊接时成品板故障案例;
1.2.2涉及相关知识
基材基本知识及相关参数;
无铅板材的选定。
1.3 印制板验收及存储
1.3.1案例
印制板存贮不当造成产品焊接质量问题;
1.3.2涉及相关知识
印制板包装、存储的要求。
2. 元件封装及选择
2.1元件结构、封装以及镀层对生产产品质量的影响
2.1.1案例:
CCGA结构对焊接及返修工艺的影响;
BGA焊球表面处理不当形成焊点的枕头效应;
同一种元件拥有两种镀层,对手工焊接工艺的影响。
2.1.2涉及相关知识
元件耐温
元件静电敏感等级
元件潮湿敏感性
元件焊端/引线、镀层的结构和材料
2.2元件选择注意事项
结构与焊端;
与生产设备匹配;
新型封装采用注意事项。
3. SMT工艺
3.1焊膏选择
3.1.1案例
软板镀金焊膏的选取;
3.1.2相关知识
焊膏认证试验。
3.2回流炉验收与调试
3.2.1案例
回流炉加热效率及热容量对批量生产的影响;
3.2.2相关知识-回流炉评估;
加热系统的评估:加热效率、横截面温差、环境补偿、温区间能力评估;
传输系统的评估:传输链、导轨、及其他部件评估;
氮气系统的评估;
冷却系统及其他系统评估;
3.3曲线调试
3.3.1案例
典型6条回流曲线分析;
各种焊膏参数分析
3.3.2相关知识
曲线每个阶段的相关方面知识及要求;
如何调制曲线。
4. 焊点可靠性
4.1焊点可靠性基础知识
4.1.1电子产品可靠性基本概念
基本概念:可靠性定义、可靠性特征量、板级产品的可靠性及涉及相关方面;
载荷条件:低周期载荷、高周期载荷、冲击载荷。
4.1.2板级产品失效模式
板级产品可靠性与失效模式关系
4.2 金属间化合物IMC
焊点的连接形式
Ni对Cu基材上IMC的影响
Cu含量对Ni基材上IMC影响
不对称焊接界面的IMC
Cu含量对焊点可靠性的影响
加热历史对IMC的影响
5. 综合案例
无铅软板LED元件镀层影响焊料选择、焊盘设计,模板设计案例;
无铅焊接工艺研究全过程介绍;
6. 3D封装IC及晶圆级封装技术专题(Enabling Technologies for 3D IC Integration and WLP)
Overview of 3D IC integration and packaging
TSV forming (DRIE and laser)
TSV dielectric, barrier, and seed-metal layers
TSV filling and CMP
Effects of TSV interposer on thermal performances on SiP
Effects of TSV interposer on mechanical performances on SiP
Stress sensor for thin-chip strength measurement
Wafer thinning and thin-wafer handling
Low-cost lead-free microbumps (≤25µm pitch): fabrication and characterization
Low-cost lead-free microbumps (≤25µm pitch): assembly and reliability
Low temperature (≤180oC) C2W bonding
Low temperature (≤180oC) W2W bonding
CMOS image sensor with TSV
3D MEMS packaging with TSV
3D LED and IC integration
Thermal management (design charts and guidelines) for 3D stacked chips
Integrated liquid cooling solutions for 3D stacked modules
Hot spots in thin chips for 3D stacking
Embedded 3D IC WLP
Optical PCB
Supply chain for 3D IC integration and packaging
Critical issues in adopting TSV with RDL and 3D IC integration
Summary
培训师介绍
美国伊利诺里大学理论和应用物理系博士,结构工程、工程物理和管理科学三个硕士学位,ASME 会士、IEEE 会士。2009 年1 月至今香港科技大学访问教授。此前,担任新加坡微电子所微机系统、模块和元件实验室主任两年,在美国HP 和Agilent 公司担任资深科学家近20 年。具有30 年研发和制造经验,发表300 多篇技术论文,100多 篇专著章节,进行250 次以上演讲。编写或参与编写过16本教科书,内容涉及先进封装,焊点可靠性,无铅焊接和制造等。
John Lau has been a visiting professor at HKUST (Hong Kong University Science & Technology) since January 2009. Prior to that, he was the Director of Microsystems, Modules & Components (MMC) Laboratory with Institute of Microelectronics (IME, Singapore) for 2 years and a Senior Scientist/MTS at HP/Agilent in US for more than 20 years. With more than 30 years of R&D and manufacturing experience, he has authored or co-authored more than 300 peer-reviewed technical publications and more than 100 book chapters, and given more than 250 presentations. He has authored and co-authored 16 textbooks on advanced packaging, solder joint reliability, and lead-free soldering and manufacturing. John earned his Ph.D. degree in theoretical and applied mechanics (University of Illinois) and three M.S. degrees in structural engineering, engineering physics and management science. He is an elected ASME Fellow and has been an IEEE Fellow since 1994.
王豫明
清华-伟创力SMT实验室主任,北京电子学会学术委员会委员,表面安装技术专业委员会委员。从事电子工艺25年,从事SMT工艺14年;曾派往新加坡接受SMT专业培训。在国内外发表论文20多篇;组织、编写《SMT工艺与可制造性设计》、《电子组装三防技术》、《电子封装与制造》等多部书籍,编写网络多媒体教材《电子元器件》;分别讲授《SMT可制造性设计》等多门课程。
本课程名称: 电子组装高端课程:3D封装与电子组装工艺技术
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